Capabilities
One-Stop Solution for PCB Fabrication & PCB Assembly
Custom PCB Fabrication & Assembly
IPC 6012 CLASS 3/3A |ISO9001:2015 | ISO13485:2016 | UL Certificated
01.
PCB Manufacturing
●1-40 layers, Rigid, Flex and Rigid Flex ● Microwave & RF, Metal core, IC Substrate ● Blind / Buried Vias, Micro Vias, Any-Layer HDI ● Via In Pad, Conductive & Non Conductive ● Impedance Control, Back drill, Heavy Copper 20 oz ● FR4, High Speed, High Frequency, Ceramic, PTFE, Polyimide
02.
PCB Assembly
Thru-hole assembly(PTH) ● Surface Mount Assembly(SMT) ● SMT & Thru-hole Mixed ● Full Turnkey Assembly, Partially or Full consigned Assembly ● Rigid, Flex, Rigid-flex PCB Assembly ● BGA, micro-BGA, QFN, CSP, As small as 0201 ● Press-fit Assembly ● AOI, X-RAY, ICT, FCT(Functional Test)
03.
EMS
● Consigned PCB Assembly ● Turnkey PCB Assembly ● PCB Parts Sourcing ● Box Build Assembly ● IC Programming ● Functional Testing ● Cable/wire harness assembly ● Conformal coating ● Repair/Rework services ● PCB Reverse Engineering ● Labeling & Packaging ● Customized Logistics
PCB Manufacturing
High Quality PCBs with Competitive Pricing
A Premier Provider of Printed Circuit Boards
- Multilayer PCBs
- Flexible PCBs
- Rigid flex PCBs
- Heavy copper PCBs
- HDI PCBs
- Aluminum PCBs
- PCB Prototype
- Gold finger PCBs
- Rogers PCBs
- Blind and buried vias PCBs
- IC Substrate PCBs
- High Frequency PCBs
Our PCB manufacturing capabilities
Layers | Mass production: 2~40 layers / Prototype run: upto 64 layers |
Max. Thickness | Mass production: 394mil (10mm) / Prototype run: 709mil (17.5mm) |
Material | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free) , Halogen-Free, Ceramic filled, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, Microwave & RF, Metal core, IC Substrate, etc. |
Min. Width/Spacing | Inner layer: 3mil/3mil (H oz), Outer layer: 4mil/4mil(1 oz), advanced: 2mil/2mil (1/3 oz) |
Max. Copper Thickness | Normal: 6 oz / Advanced: 20 oz |
Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
Max. Panel Size | 1150mm × 560mm |
Aspect Ratio | 18:1 |
Surface Finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, Via in PAD, Cavity boards, Any layer HDI |
IPC Class 3/3A, Jump Score, Counterbores, Countersinks, Edge Castellations, Edge Castellations, Resistance control, Impedance control |
PCB assembly service
SMT PCB assembly, Through hole PCB assembly, BGA assembly, turnkey PCB assembly
One-Stop Solution for PCB Fabrication & PCB Assembly
- PCB Fabrication
- Mixed Technology (SMT/Thru-hole)
- Turnkey/Partial Turnkey Assembly
- BGA assembly
- Quick turn Assembly
- Kitted/Consigned Assembly
- Components Sourcing
- PCB Prototype Assembly
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Email: sales@wholepcb.com
Our PCB Assembly capabilities
SMT | Position accuracy: 20 um |
Components type: BGA, uBGA, QFN, DFN, SOP, PLCC, POP, CGA, CSP and Leadless chips, as small as 0201 | |
Max. component height: 50mm | |
Max. PCB size: 680×500mm | |
Min. PCB size: no limit | |
PCB thickness: 0.1 to 10mm | |
PCB weight: 3KG | |
Wave-Solder | Max. PCB width: 600mm |
Min. PCB width: no limit | |
Component height: Top 120mm | |
Sweat-Solder | Metal type: part, whole, inlay, sidestep |
Metal material: Copper, Aluminum | |
Surface Finish: plating Au, plating sliver, plating Sn | |
Press-fit | Air bladder rate: less than 20% |
Press range:0-50KN | |
Max. PCB size: 800X600mm | |
Testing | AOI, X-ray, ICT, Probe flying, burn-in, function test, temperature cycling |
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Email: sales@wholepcb.com
Our Working Process
Evaluation
Before production, our engineer will check if there is any error in PCB Gerber and BOM, to avoid mistakes.
Proposal
We will send customer engineering questions about the files and recommend the best solution.
Manufacturing
“Quality Comes First” is our motto which is engraved in every staff of Viasion in our manufacturing.
Inspection
Our quality control team will test PCBs by AOI, ICT, FCT etc., to make sure high-quality products.
Our Factory Show
F.A.Q
1. What is your lead time?
The lead time for different PCB may be different, our normal lead time is 1-3 weeks for PCB bare board, and 2-8 weeks for PCB assembly.
2. What is the minimum requirement for the order?
We don’t have min. order quantity. We welcome orders as low as 1 piece since we focus on Small to Medium Volume Production.
3. What you can do for us?
We provide custom PCB bare board manufacturing, PCB assembly, components sourcing, IC programming, cable assembly, box build assembly, complete electronics assembly and storage.
4. How do you control quality in our production?
1). Our experienced engineers will do DFM (Design for manufacturing) and DFM (Design for assembly) before production, to avoid design errors
2). We make sure quality management systems like ISO9001:2016 are implemented in our production;
3). All our PCB bare boards are 100% open/short tested, AOI inspected and visually inspected；
4). All our PCB assembly will be 100% AOI inspected, ICT testing and FCT if needed;
5). Before mass production, we will produce a small production first for approval.
5.Can you arrange the shipping for my order?
Yes, we can arrange shipping for you, by sea, by air or by EXPRESS.
6. What files do you need for production for our PCB?
We need Gerber files for PCB Manufacturing, Gerber files + BOM for PCB Assembly, and Gerber files + BOM + drawing for the other material for Electronic Manufacturing Services.
Get A Free Quote Today
Click Here to contact us
Email: sales@wholepcb.com