In most cases, a rigid flex PCB assembly is the same as a flexible PCB, but there are some specific points that make them different from one another. For example, the two types of PCBs require different component placement and solder paste methods, as well as additional requirements. If you’re assembling a rigid flex PCB, it’s important to consider these points when assembling it.
rigid flex pcb assembly
A rigid flex PCB assembly can be bent to certain degrees, but it’s important to design the bend area carefully, as mechanical stress can cause weak pads in these areas. For added protection, route traces perpendicular to the bend line, and add dummy traces to strengthen the area. Using a rigid flex PCB designer is a great way to get an optimized rigid flex design.
rigid flexible PCB assembling
The benefits of a rigid flex PCB assembly are numerous. By combining the best of rigid and flexible PCb technologies, you can lower the design cost of your PCBs while addressing fabrication issues and mistakes. You can also get more flexibility when routing flex traces, as these boards can be curved and shaped to fit the design of your PC. It also helps eliminate assembly issues associated with reflow annealing.
A rigid flex PCB assembly is more difficult to produce than a traditional PCB because of the complex fabrication process. It requires effective and appropriate software, and it is costly. The rigid flex PCB assembly is often made of polyimide, a highly durable material that is highly resistant to shock and vibrations. In addition to being strong and flexible, it is also resistant to corrosion and soil damage. But the process is expensive, as it requires complex machinery and high-quality materials.
A rigid flex PCB assembly is a combination of FPC and PCB production equipment. First, an electronic engineer draws the circuit for the flexible PCb board. The CAM engineer then processes the relevant documents and organizes the production site. After all, a rigid flex board requires both PCB and FPC production lines. The assembly process starts with a series of details and then the board is formed on the pressing machine.
Rigid flex PCBs are a combination of a rigid board and a flexible circuit.
rigid flex PCB fabrication
The rigid flex PCB fabricator attaches PTH to the rigid boards. These boards can be made with multiple layers of PTH. The result is a high-precision, durable circuit board. A rigid flex PCB also has high-precision and vibility. The PCB also has better electrical performance.
Copper is the most common conductor material in a rigid flex circuit assembly. Copper is available in many different weights and thicknesses and has good electrical properties. For circuitry applications, copper foil comes in two forms: electro-deposited copper foil and rolled annealed copper foil. In both cases, the copper is chemically treated to increase adhesion, strengthen bonds and resist oxidation. Further, constantan foil is adopted for manufacture of FPCs with a constant thickness.
We are PCB manufacturer provide pcb fabrication service such as PCB Assembly, Assembly Boards, Box Build Assembly, PCB Assembly Service, and supply Flex Pcb, Fr4 Pcb, HDI PCB, LED PCB, Multilayer PCB, Rigid Flex PCB, Rigid PCB etc.
Our FPC manufacturing capability |
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| Content | Regular Capability | Special |
| Layer | 1-6L | Above 8L |
| Min.board Size | 1-*1mm | |
| Max.board thickness | 0.23mm | 0.4mm |
| Min.board thickness | 0.075mm | 0.065mm |
| (0.075mm≤T Tolerance±0.03mm | V | 575 |
| Max.Array Size | 500*600mm | 250*1500mm |
| (0.6mm≤T Tolerance±0.1mm | %(50-260℃) | 0.5 |
| Max Drill bit Diameter | 6.5mm | |
| Min Drill bit Diameter | 0.20mm | 0.15mm |
| Routing tolerance | ±0.2mm | ±0.15mm |
| Min Base Copper | 1/3 OZ | 1/4 OZ |
| Max Base Copper | 2 OZ | 4 OZ |
| (0.035mm≤T Tolerance±0.05mm | ℃ | 130 |
| Min Coverlay Thickness | 1mil(PI0.5mil Adhesive 0.5mil) | |
| Tolerance of holes diameter(PTH) | ±0.05mm | |
| Tolerance of holes diameter(NPTH) | ±0.025mm | |
| Hole Position Deviation(hole to hole compared with the CAD data) | ±0.05mm | |
| Hole Position Deviation(copper foil to hole compared with the CAD data) | ±0.07mm | |
| Max Coverlay Thickness | 2mil(PI1mil Adhesive 1mil) | |
| Soldermask thickness | Photo sensitive:0.007-0.02mm(0.3-0.8mil) Printed backing:0.01-0.025mm(0.4-1mil) | |
| Soldermask printing offset tolerance | Photo sensitive:±0.1mm(±4mil) Printed backing:±0.3mm(±8mil) | ±0.075mm ±0.2mm |
| Offset tolerance of silk character | ±0.3mm | ±0.2mm |
| Min distance copper foil to the edge | ±0.10mm | ±0.07mm |
| PTH wall copper thickness | 12-18um | |
| Minimum Trace Width/Space | 1/3OZ Cu 1L 50/60um 1/2OZ 2L 70/80um 1OZ Cu 1L 70/80um 1OZ Cu 2L 80/90um | |
| Gold plating, Au thickness(Gold finger or other parts) | 1-6u inch | 1-10 u inch |
| Gold plating, Ni thickness(Gold finger or other parts) | 1-6 u inch | Min 30 u inch Max 280 u inch |
| Tin thickness(Max),(Min)/Tolerance | (0.2mil)-(2.0mil)±0.30mm | |
| Min protective film lamination spilled glue amount | 0.5mil Adhesive≤0.1mm(4mil) 1mil Adhesive≤0.15mm(6mil) | |
| Protective film alignment accuracy(joint offset tolerance) | ±0.15mm | ±0.10mm |
| Alignment tolerance of fixture joint operation | ±0.15mm | |
| Alignment tolerance of manual joint operation | ±0.30mm | ±0.2 |
| ENIG Ni/Au thickness(Gold finger or other parts) | Ni:30-150u inch Au:±1u inch | 4 u inch |
| Die Punching Min hole/tolerance | Min:0.5mm/±0.05mm | +0.06/-0mm |
| (OSP) | 0.2-0.8um | |
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