Advantages of Through-Hole PCB Assembly
Through-Hole PCB Assembly is often compared to the more common surface mount technology, which many people view as superior. However, through-hole PCB assembly is not without its own advantages, especially when it comes to high-voltage applications. Through-hole soldering creates a strong bond between circuit components and leads. Leads are pre-drilled and then threaded into the through-hole assembly. This method increases the mechanical strength of the boards and is particularly useful in high-voltage applications.
There are several advantages to surface-mount technology. In particular, it can mount more components and takes up less real estate on a board. Because it uses fewer drilling holes, it is more efficient and reduces production time. However, a machine used for surface-mount assembly costs more. This factor can drive up the cost of production, especially if the board will only be used a few times. This is especially true if the board has small component counts.
Through-hole PCB assembly part more durable
A through-hole PCB assembly is highly durable, allowing for the precise placement of electronic components without having to worry about soldering. In addition, it is much faster than surface-mount assembly, which requires automated pick and place equipment. Nonetheless, through-hole PCB assembly is not the ideal solution for small-volume production. Depending on the complexity of the board, it might be better to use the surface-mount method when it is possible.
Through hole technology with higher levels of mechanical stress
Through-hole PCB assembly is an excellent option for products that require high levels of precision, especially when using large components. This technology is a great choice for large components, such as semiconductors or electrolytic capacitors. This technology also provides additional security when the components are subjected to high levels of mechanical stress. For this reason, through-hole PCB assembly is preferred for products that have high-power levels.
After PCB manufacturing, the next step is component placement. The process may be manually performed or automated with pick and place systems. Manual component placement requires high precision, but automated components placement can be just as accurate and faster. Unlike manual component placement, automated PCB assembly requires no soldering or rework. Instead of manually placing components, robotic systems place them on the PCB with exceptional accuracy. These automated PCB assembly processes are more cost-efficient and highly accurate than manual PCB assembly, and they can be programmed to place components with high accuracy.
Reliability
Through-hole PCB assembly is the preferred method of circuit assembly because of its high heat tolerance and resilience. While surface mount components are more convenient, they have fewer advantages when it comes to reliability. Surface mount components are more compact and can be used in denser configurations, but heavier components require higher-quality bonds. Through-hole PCBs are highly resilient and relevant for high-reliability products. Unlike surface mount components, through-hole PCBs can be manufactured at low volume, and there are no minimum order requirements.
Design for Through hole technology
If you’re designing a product for through-hole PCB assembly, it’s crucial to consider several factors, including the components’ functions, relative spacing between them, and the board’s potential for defects. A well-designed PCB board should preserve components’ pads and via designs, for example, while minimizing the chance of warping. Ensure the completeness and correctness of design data by checking all manufacturing files.
If possible, model through-hole components as footprints in your PCB design CAD system. Use the most recent data sheets for through-hole components and create part outlines at the width of the component’s maximum material. Always use the correct finished hole size when designing a PCB, and remember to include keepout zones, clearances, and component heights. Through-hole PCB assembly requires more drilling, which increases manufacturing costs and production efficiency.
Through hole technology vs SMT assembly Cost
Typically, the costs of through-hole PCB assembly are based on the number of boards being assembled. The higher the number, the lower the cost. However, if a board is to be fabricated for a large number of uses, the cost may be higher. There are a few different ways to reduce the cost of assembly. One option is to reduce the number of components. This method is best suited for smaller orders that require a small number of components.
Through-hole PCB assembly requires fewer parts, which can be less expensive. In addition, it is more reliable and allows for easier component exchange. Unlike surface-mount (SMT) components, through-hole components have a superior bond between the circuit board and the components. It is also better for larger components. Through-hole PCB assembly can be highly automated. Further, through-hole PCB assembly can be more affordable than surface-mount PCB assembly.
What Are the Disadvantages of Through-Hole PCB Assembly?
What are the disadvantages of through-hole, or SMD, PCB assembly? This article will discuss four main drawbacks of this method of assembly. They include: Time-consuming, Expensive, and Unsuitable for multi-layer PCBs. We’ll also discuss the reliability of the finished PCB. Read on to discover the advantages and disadvantages of SMD PCB assembly!
- Time-consuming
Through-hole PCB assembly is a time-consuming process that requires a lot of manual labor, and the disadvantages of this process are a major reason why most new projects are moving toward surface mount. Unlike surface mount PCBs, however, through-hole PCBs have holes that are further apart than their SMT counterparts. A typical spacing between through-hole PCB holes is approximately 0.0100″ (0.6mm). This generous spacing makes through-hole assembly a very easy process, with a near-zero risk of accidental bridges.
Through-hole assembly requires a high-quality solder paste. A contract manufacturer must screen an unpopulated board, then place blocks on the solder paste in a stencil. Once the boards are assembled, they go into a reflow oven where the solder paste hardens to form a solder joint. Time-consuming disadvantages of through-hole PCB assembly are outweighed by its higher volume and reduced lead-time.
- Expensive
If you’re interested in minimizing PCB assembly costs, you should choose one-layer boards. These boards have as few as six layers, while a 12-layer board will cost as much as four times as much. Also, more layers require more material, so the overall cost of assembly will be higher. This is one reason why most assembly shops require a 10mm free-space area around the board. Choosing the right PCB material is essential for minimizing PCB assembly costs.
When selecting the right via for your board, make sure you know what types of parts will be installed. Regular through-hole components, such as resistors and capacitors, will be soldered into plated through-holes. Other parts will be installed into non-plated holes, such as guide pins, connector legs, and mounting hardware. Make sure you know the difference between these two options before deciding which one is best for your specific project.
- Unsuitable for multi-layer PCBs
The main benefit of multi-layer PCBs is the high density of layers, which provides improved electrical properties and reliability. Multilayer PCBs are smaller, lighter, and more portable than double-layer boards. The manufacturing process requires more planning and fabrication time. Nonetheless, multi-layer PCBs are much faster and cheaper than double-layer boards. These advantages make them a preferred choice for certain applications.
The manufacturing process of multi-layer PCBs is complex, requiring high-end machinery and extreme skills. This process is prone to errors and inefficiency, and can result in the loss of several boards. Because of these difficulties, through-hole PCB assembly is not suitable for multi-layer PCBs. But if you really need multi-layer PCBs, you should opt for the process of double-sided multilayer PCB assembly.
Why SMT so popular, Through-Hole Technology still exist?
Through-hole technology is a technique for mounting electronic components using holes in the boards. This mounting method provides better mechanical bonds than through-hole mounting. However, through-hole mounting can be costly as it requires holes to be drilled through all the layers and to the other side. This technique is often held for large and bulky parts, where extra quality is important. This article will explore the benefits of through-hole technology and what it can do for your project.
Through hole technology meaning
Through-hole technology is a popular method for assembling PCBs. It consists of drilling holes into the bare PCB, where leads of electronic components are inserted. Because the electrical components are placed inside the holes, the mechanical bonds between them are stronger. However, the through-hole mounting process requires additional drilling, which increases production costs. Also, the holes on the PCB limit the area available for signal traces.
Electronic components
Through-hole technology is used in the manufacture of semiconductors, transformers, electrolytic capacitors, plug connectors, and other types of electronic hardware. This type of technology is used in aerospace, industrial, and military equipment, and can withstand harsh operating environments. Today, most electronic hardware is made with surface-mount technology, but through-hole technology is still a valuable part of the electronics industry. With its benefits and ease of use, through-hole components are an important part of the electronics industry.
Vias
Through-hole technology uses vias to connect component pins to pads. This type of technology minimizes the number of large through holes on a PCB. In addition, using non-THT vias reduces the number of traces on the board. The rest space may be used for massive-area shielding. This type of shielding is also beneficial to the EMI/RFI performance of a board. Vias are also useful in shielding key network cables and internal components.
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